Eximietas News And Events
Mastering first-time silicon success
Achieving First-Time Silicon Success (FTSS) is the paramount goal in ASIC development, directly impacting market timelines and billions of dollars…
Semiconductor 3D Packaging
We need bigger and faster devices to manage more complex and larger amounts of data. As data evolves, the amount…
Known good die - Wafer Probe Testing
Wafer testing has long been used to evaluate bare dies that are still part of the wafer. This process allows…
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Eximietas Design Acquires R2M2
Posted by Eximietas
Eximietas Design Acquires R2M2 to Bolster DevOps Expertise and Accelerate Cloud Adoption. San Jose, CA…






